. Cleaner, More Reliable Solder Joints
Improves cleaning action, reducing oxidation on tiny pads and component leads.
This results in better electrical conductivity and lower resistance at each joint.
. Better Heat Transfer and Flow
The enhanced flux helps the solder flow smoothly and evenly over small, heat-sensitive parts.
. Reduced Need for Rework
Fewer mistakes and more successful joints on the first try, saving time and effort.
. Minimal Residue
Leaves very little residue
